Amkor Technology (AMKR) Investor presentation summary

Company overview and market position

• Over 55 years of experience in semiconductor packaging and testing, with $6.7B in 2025 revenue and operations in 8 countries.

• 83% of 2025 revenue from advanced packaging, with a 9% CAGR in this segment from 2020–2025.

• Largest US-headquartered OSAT, with US manufacturing expansion planned.

• Broad geographic footprint with 13 million square feet of manufacturing space across Asia, Europe, and the US.

• Trusted by leading global semiconductor companies, including NVIDIA, Samsung, Qualcomm, and TSMC.

Strategic focus and growth drivers

• Strategy centers on technology leadership, geographic expansion, and strong partnerships in key markets.

• Positioned to support megatrends in 5G, HPC, AI, automotive electronics, and IoT devices.

• Turnkey service offering reduces cycle time and increases value through design innovation and integrated manufacturing.

• Investments target advanced packaging, regional supply chains, and new facilities in the US, Korea, and Portugal.

Financial performance and capital allocation

• 2025 revenue reached $6.7B, with gross margin at 18.8% and operating margin at 7.0%.

• Free cash flow in 2025 was $308M, with EBITDA of $1.16B and debt/EBITDA ratio at 1.2x.

• Capital expenditures for 2025 totaled $905M, with 2026 CapEx expected at $2.5B–$3.0B for facility expansion and advanced packaging.

• Capital allocation prioritizes organic growth, strategic investments, balance sheet strength, and returning 40–50% of free cash flow to shareholders.