Logotype for GlobalWafers Co. Ltd.

GlobalWafers (6488) Q1 2026 earnings summary

Event summary combining transcript, slides, and related documents.

Logotype for GlobalWafers Co. Ltd.

Q1 2026 earnings summary

25 Jun, 2026

Executive summary

  • Q1 2026 saw gradual semiconductor market recovery, driven by AI, HPC, and broader end-market applications, with inventory correction largely complete but recovery still uneven.

  • Revenue for Q1 2026 was NT$13,985 million, down 3.6% sequentially and 10% year-over-year, with net income of NT$1,895.9 million, up 30% from Q1 2025.

  • Gross margin declined to 20.8% from 25.7% in Q4 2025 and 26% in Q1 2025, while operating margin dropped to 10.5% and net margin improved to 14%.

  • Expansion projects are moving from investment to ramp-up and qualification, with operational focus shifting to realizing returns.

  • Government subsidies from the US and Europe exceeded TWD 11 billion, strengthening the balance sheet and financial flexibility.

Financial highlights

  • Q1 2026 revenue was TWD 13.98 billion, down 3.57% quarter-over-quarter; gross profit was TWD 2.91 billion, with a gross margin of 20.8%.

  • EPS was TWD 3.97, up from TWD 3.05 in Q1 2025.

  • EBITDA for Q1 2026 was NT$4,060 million, with a margin of 29.0%.

  • Net profit increased 30.2% year-over-year, mainly due to mark-to-market gains on Siltronic shares.

  • Prepayment balance at TWD 23.5 billion, down 5.5% QoQ, reflecting fulfillment of long-term agreements.

Outlook and guidance

  • Full-year 2026 operating performance expected to improve sequentially and exceed 2025 levels on a constant currency basis.

  • AI infrastructure investment and advanced packaging are expected to offset macro headwinds and sustain high utilization in 12-inch wafer lines.

  • Recovery in mature-node segments and smaller-diameter wafers is anticipated as inventory normalization progresses.

  • CapEx has peaked; focus is now on ramp-up, yield improvement, and operational efficiency.

  • Pricing improvement is anticipated in the second half of 2026, especially for 12-inch wafers, due to high utilization and rising costs.

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