Intel (INTC) Intel Foundry Direct Connect Keynote summary

Opening remarks and strategic vision

• Emphasis on customer feedback and partnership as central to future strategy.

• Commitment to strengthening the foundry business and improving execution and roadmap.

• Highlighted the foundational role of semiconductors and the growing impact of AI, projecting a $1 trillion industry by 2030.

• Investments in advanced R&D, process technology, and packaging to maintain leadership.

• Focus on building a resilient global supply chain and engineering-first culture.

Technology roadmap and manufacturing updates

• Intel 18A node supports Panther Lake products, with first launch at year-end and more SKUs in early 2026.

• 14A node development aims for broader market reach and best-in-class performance.

• Advanced packaging solutions like EMIB and Foveros drive efficiency and cost benefits.

• Expansion of manufacturing capabilities in the US, Europe, and Asia, with significant investments in advanced packaging.

• High-NA EUV tools deployed for 14A, offering flexibility and yield parity with low-NA solutions.

Ecosystem partnerships and enablement

• Deep collaborations with Synopsys, Cadence, Siemens, and PDF Solutions to enhance IP, EDA, and design flows.

• Synopsys and Intel have enabled foundation and I/O IP on 18A, with early engagement on 14A.

• Cadence partnership focuses on AI-driven EDA tools and productivity improvements.

• Siemens EDA collaboration centers on design for manufacturability and advanced packaging, including EMIB and chiplet alliances.

• PDF Solutions supports design for yield and manufacturability, integrating analytics and early engagement for advanced nodes.