53rd Annual JPMorgan Global Technology, Media and Communications Conference
Logotype for KLA Corporation

KLA (KLAC) 53rd Annual JPMorgan Global Technology, Media and Communications Conference summary

Event summary combining transcript, slides, and related documents.

Logotype for KLA Corporation

53rd Annual JPMorgan Global Technology, Media and Communications Conference summary

3 Feb, 2026

Market environment and growth outlook

  • Strong growth in wafer fab equipment (WFE) driven by leading-edge investments, especially at the 2-nanometer node and high-performance computing applications.

  • Advanced packaging is a major new growth area, with revenues expected to rise from $500 million to $850 million, reflecting a 70% increase.

  • WFE market is up mid-single digits year-over-year, with process control outpacing WFE and KLA's growth in the low double digits.

  • Service business is growing at about 10% despite some access issues in China, providing a stable revenue stream.

  • Gross margin is modeled at 62.5%, with operating margins at the higher end of the 40–50% leverage target.

Industry trends and drivers

  • WFE intensity has structurally increased since the mid-2010s, supporting higher capital investment and less cyclicality.

  • Introduction of EUV technology reignited scaling and design activity, especially in logic, driving process control intensity.

  • Shift toward high-performance compute and integration with memory is creating new challenges and opportunities in process control and packaging.

  • KLA's share of WFE has grown from the low 6% range to nearly 8%, reflecting increased relevance.

  • Process control is expected to continue outgrowing WFE due to rising complexity and risk in advanced nodes.

Market share and competitive positioning

  • KLA outgrew the process control market, gaining 30 basis points of share and maintaining a strong lead in five of six major subsegments.

  • Significant share gains in electron beam (e-beam) inspection, doubling revenues and gaining 700 basis points of share.

  • Optical inspection remains dominant, but e-beam is growing faster and is increasingly adopted for specific use cases.

  • Advanced packaging and e-beam inspection are key areas for future share gains.

  • KLA's portfolio approach and ability to address both process control and specialty semiconductor tools underpin its market strength.

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