Techwing (089030) Q4 2025 earnings summary
Event summary combining transcript, slides, and related documents.
Q4 2025 earnings summary
29 Mar, 2026Segment performance
HBM specialized Cube Prober is the only solution for full HBM inspection, with expanding sales and market presence among major memory manufacturers including Samsung, SK hynix, and Micron.
SOC Test Handler with Tri-Temp technology is increasing its market share, with TechWing preparing next-generation products.
Memory Test Handler for DRAM/NAND leads global market share, with ongoing development for future products.
Market and industry conditions
The total semiconductor equipment market, including wafer fab, test, assembly, and packaging, is projected to grow from 2023 to 2027, reaching up to $160 billion by 2027.
Test equipment is a significant segment within the overall semiconductor equipment market, as forecasted by SEMI.
Latest events from Techwing
- H1 2024 saw a sharp revenue drop and net loss, but R&D and strategic investments continue.089030
Q2 202425 Jun 2026 - Revenue up 3.2% to ₩137.8B, net income ₩4.5B, with strong semiconductor demand and new solar business.089030
Q3 202425 Jun 2026 - Q1 2025 revenue and profit fell sharply, with net loss and high customer concentration risk.089030
Q1 202525 Jun 2026 - H1 2025 saw a return to profitability with strong semiconductor test equipment sales and global expansion.089030
Q2 202525 Jun 2026 - Q3 net income rebounded despite lower sales, with continued focus on R&D and capital efficiency.089030
Q3 202525 Jun 2026 - Q1 2026 saw a 67% YoY revenue drop and a net loss, with high customer concentration risk.089030
Q1 202622 Jun 2026 - Revenue up 38.9% YoY, but net loss persists; dividend maintained, solar business added.089030
Q4 202412 May 2026