Amkor Technology (AMKR) 51st Nasdaq London Investor Conference summary

Strategic priorities and R&D focus

• Emphasis on technology leadership, geographic diversity, and targeting key semiconductor growth drivers.

• R&D efforts are closely aligned with lead customers in communication, compute, automotive, and wearables.

• AI-enabled smartphones, next-gen package technology, and higher memory/interconnect density are top priorities.

• Strong position in GPUs and data center AI, with significant investment in 2.5D packaging and interposer technologies.

• Automotive innovation focuses on power management modules and advanced ADAS processors, with ongoing investment in wearables for miniaturization.

Geographic expansion and supply chain strategy

• Significant investment in a U.S. manufacturing facility, supported by government initiatives like the CHIPS Act.

• Collaboration with TSMC to ensure seamless manufacturing in both Asia and the U.S.

• U.S. facility targets specific markets such as data centers, military, and select devices, not a full supply chain shift.

• Advanced packaging is now a U.S. government priority, with support for domestic facilities to avoid inefficient overseas supply chains.

Advanced packaging and technology roadmap

• 2.5D process capacity tripled from 2023 to 2024, with further expansion planned into 2025.

• 2.5D and CoWoS technologies are expanding beyond GPUs to switches and other data center applications.

• Wafer-level processing expertise enhanced by the acquisition of Nanium and integration of fan-out technology.

• Market share in AI and data center packaging expected to grow as technologies mature and proliferate from TSMC to OSATs.

• Only a few global players expected to dominate the advanced packaging OSAT market.