BofA Securities 2024 Global Technology Conference
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Lam Research (LRCX) BofA Securities 2024 Global Technology Conference summary

Event summary combining transcript, slides, and related documents.

Logotype for Lam Research Corporation

BofA Securities 2024 Global Technology Conference summary

31 Jan, 2026

Industry outlook and growth drivers

  • Semiconductor industry is expected to reach $1 trillion in sales, driven by AI and automotive sectors, with capital intensity per wafer increasing at each new process node.

  • 3D architectures like Gate-All-Around and advanced packaging are expanding the addressable market for equipment providers.

  • AI servers require significantly more silicon, DRAM, and NAND, boosting wafer fab equipment (WFE) demand.

  • Government investments in the US, China, Europe, and Japan are expected to drive future equipment orders, though most benefits are yet to materialize.

  • The industry remains cyclical, with recent cycles influenced by COVID-related demand pull-forward and inventory corrections.

Market trends and segment performance

  • WFE spending is in the low- to mid-$90 billion range this year, with leading-edge foundry and logic showing strength, while NAND remains weak but expected to recover next year.

  • China’s investment is growing this year, first half weighted, with a broad customer base in mature nodes and memory, supported by a new $47 billion government fund.

  • China’s mix is expected to normalize from 40%+ to low 30s as global recovery, especially in memory, offsets its share.

  • Gross margins reached an all-time high due to a favorable customer mix in China but are expected to soften and stabilize at around 48% as the mix shifts.

  • Service business (CSBG) remains strong, with spares and upgrades growing alongside the installed base, while Reliant product line is softer this year.

Technology and product innovation

  • Lam’s exposure to HBM (high-bandwidth memory) is significant, with proprietary tools for deep silicon etching and metallization, enabling rapid growth in advanced packaging revenue, expected to exceed $1 billion this year.

  • Transition from FinFET to Gate-All-Around is driving consistent growth, with $1 billion in revenue expected from this node this year and more investment anticipated next year.

  • AI server adoption is incremental to traditional enterprise servers, not cannibalizing existing investments.

  • NAND’s role in AI is growing, with SSD demand rising as the industry shifts from hard disk drives to higher-density NAND technologies.

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