Lam Research (LRCX) UBS Global Technology and AI Conference summary
Event summary combining transcript, slides, and related documents.
UBS Global Technology and AI Conference summary
12 Jan, 2026Export controls and China market dynamics
Recent export controls added both chipmakers and equipment companies to the Entity List, impacting prior customers and shifting demand to domestic Chinese equipment providers.
New restrictions are expected to make it harder for Chinese equipment firms to source from outside China, potentially benefiting non-Chinese competitors.
The pace of new Chinese customers is slowing, but there is no sign of consolidation among them.
China WFE spending is expected to decline next year, but global growth will offset this.
Deferred revenue increased due to larger down payments from new Chinese customers, though overall spending may be moderating.
Industry outlook and technology trends
2025 is expected to be a growth year for WFE, with 2024 WFE estimated at around $95 billion.
NAND investments and upgrades will drive growth, with Lam holding strong share in key upgrade areas.
Leading-edge foundry logic and DRAM, especially for DDR5 and HBM, are expected to remain strong, while trailing edge logic may soften.
The transition to molybdenum from tungsten in NAND is set to begin mid-next year, creating new equipment demand.
3D DRAM is anticipated to emerge late in the decade, increasing etch and deposition intensity.
Business segments and competitive positioning
The customer support business group (CSBG) now accounts for over 40% of revenue, with spare parts as the largest component and Reliant as the second largest.
CSBG growth is driven by an expanding installed base, generating more revenue over the equipment lifecycle than initial sales.
Lam maintains a leading position in advanced packaging, especially in HBM and through-silicon via applications.
The company is well positioned in Cryo etch technology, with over 1,500 chambers in production and no significant competitive wins by peers.
The acquisition of SEMSYSCO accelerates entry into fan-out panel-level packaging, with industry adoption expected around 2027-2028.
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